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    WSS(wafer support system)晶圓承載系統2020-01-13  瀏覽次數:

    WSS(wafer support system)晶圓承載系統。


    WSS晶圓承載系統提供了一個臨時的鍵合解決方案,方案用于晶圓減薄工藝和減薄后工藝期間對晶圓的支撐。

    The Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations.


    這個方案是在真空環境下,通過在晶圓表面旋涂UV粘合劑,再進行UV固化的方式,實現玻璃與晶圓之間的臨時鍵合。因為是真空環境,所以可以保證晶圓和玻璃之間不會產生氣泡。

    The  UV curable adhesive is spun on the wafer surface and is used as a bonding agent between the glass support substrate and the wafer. The mounting process is performed under vacuum ensuring that no bubbles are entrapped between the wafer and the support glass. Grinding stress to the wafer can be minimized because the UV-curable adhesive flows into and supports the topography of the circuit patterns on the front side of the wafer.


    WSS這種均勻的支撐方式可以使得晶圓減薄后的最小厚度能夠達到20微米,且在晶圓減薄后,玻璃載板可支持晶圓減薄后的任何工藝,如蝕刻、CMP(化學機械研磨)、金屬沉積等,同時也能夠輕松地將晶圓轉移到切割膠帶或切割框架上,只需要通過激光進行脫膠處理,便可剝離、移除玻璃載板。

    This uniform support allows wafer thinning to less than 20μm final thickness.After wafer thinning, the glass substrate provides support for any post grind processes such as etch, CMP, metal deposition or simple transfer to dicing tape and frame where the glass substrate is removed by laser debonding of the adhesive-glass interface. And thinning the wafer is only one step in our process offerings. 



    image.png

    1)安裝(在晶圓上旋涂UV膠;通過真空環境與玻璃鍵合到一起;紫外線照射固化)

    1)Mount(Spin coat UV resin on wafer; vacuum bond to support glass; UV irradiate)

    image.png


    2)使用常規研磨方法進行背面研磨

    2)Backgrind using conventional grind methods

    image.png

    晶圓減薄研磨期間、之后都能夠得到均勻、充分的支撐,保證操作安全。

    Thinned wafer is fully supported after backgrind operation for safe handling

    image.png

    3)使用標準晶片安裝系統將鍵合晶片安裝在切割框架上

    3)Bonded wafer stack is mounted to saw frame using standard wafer mounting systems


    image.png

    4)激光照射——通過激光照射進行脫膠,在LTHC層產生微小的空隙,使晶圓與玻璃可以進行分離。

    4)Laser Irradiation - The laser debond creates micro voids in the LTHC layer allowing for separation between glass support and wafer


    image.png

    5)移除支架——激光脫膠后,玻璃可輕易脫落,進行清洗后可循環使用。

    5)Remove Support - After laser debonding, the glass support lifts off easily and is cleaned and recycled for multiple uses


    image.png

    6)去除粘合劑——粘合劑很容易清除,幾乎沒有殘留。

    6)Remove Adhesive - Adhesive layer removes easily, leaving minimal to no residue



    其中,光熱轉換(LTHC)層通過旋涂工藝可與WSS(臨時鍵合/解鍵合)工藝一起搭配使用。而且,涂覆后玻璃載板的透光性也是可以通過驗證的。

    The Light To Heat Conversion (LTHC) layer is applied via spin coating process and cured for use with the WSS process. Glass substrates are verified after coating for proper levels of light transmittal


          本文翻譯轉載自:https://smtnet.com/company/index.cfm?fuseaction=view_company&company_id=55969&component=catalog&catalog_id=21634

            

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